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· June 1 - June 4, 2021. Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2021 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2021 will be held virtually.
We invite you to register for ITherm 2021 Virtual - https://cvent.me/rqKBlA. ITherm conference registration includes access to all virtual live and recorded events associated with ITherm 2021 Virtual and electronic copy of the conference proceedings. The registration fees are: IEEE Member Fee: $150. Non Member Fee: $225.
2021 Committee | IEEE Intersociety Thermal and Thermomechanical Conference.
The ITherm 2021 Virtual Conference will be held June 1-4. ITherm 2021 Virtual is packed with many live and recorded activities. Registration fees for the virtual conference are greatly reduced from previous years and include access to all virtual live and recorded events and an electronic copy of the conference proceedings. Join us from 12:00-5:00 ...
· On behalf of the ITherm 2021 Organizing Committee, we would like to thank you for your patience and understanding during this time of transition to a virtual conference. The organizing committee has decided that all technical papers will now be presented virtually as …
The organizing committee is delighted to announce that this year's ITherm will feature a live and interactive Student Poster and Networking Session that mostly represent a real in-person experience. The live poster session provides opportunities for students to present their research and get connected with academic and industrial representatives (June 1st- June 4th, 2021).